Factory Lead Time  

12 Weeks

Mounting Type  

Surface Mount

Package / Case  

8-VDFN Exposed Pad

Surface Mount  

YES

Number of Pins  

8

Data Converters  

A/D 4x10b; D/A 1x5b

Power Dissipation (Max)  

800mW

Number of I/Os  

6

Watchdog Timers  

Yes

Operating Temperature  

-40°C~85°C TA

Packaging  

Tape & Reel (TR)

Series  

PIC® XLP™ 12F

Published  

2010

JESD-609 Code  

e3

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

8

Terminal Finish  

Matte Tin (Sn) - annealed

Voltage - Supply  

3V

Terminal Position  

DUAL

Peak Reflow Temperature (Cel)  

260

Frequency  

32MHz

Time@Peak Reflow Temperature-Max (s)  

40

Base Part Number  

PIC12LF1822

Interface  

I2C, LIN, SPI, UART, USART

Memory Size  

3.5kB

Oscillator Type  

Internal

RAM Size  

128 x 8

uPs/uCs/Peripheral ICs Type  

MICROCONTROLLER, RISC

Core Processor  

PIC

Peripherals  

Brown-out Detect/Reset, POR, PWM, WDT

Program Memory Type  

FLASH

Core Size  

8-Bit

Program Memory Size  

3.5KB 2K x 14

Connectivity  

I2C, LINbus, SPI, UART/USART

Bit Size  

8

Has ADC  

YES

DMA Channels  

NO

Data Bus Width  

8b

PWM Channels  

YES

DAC Channels  

NO

Number of Timers/Counters  

3

EEPROM Size  

256 x 8

On Chip Program ROM Width  

8

Low Power Mode  

YES

Number of Programmable I/O  

5

RAM (words)  

128

On Chip Data RAM Width  

8

Height Seated (Max)  

1mm

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free